India's First Advanced 3D Chip Packaging Unit
India is setting up its first advanced 3D chip packaging unit in Bhubaneswar, a groundbreaking project under the Rs 76,000 crore India Semiconductor Mission (ISM). The unit, expected to significantly advance India's semiconductor capabilities, is being closely monitored by the government.
Project Overview
- The project has a budget of Rs 1,934 crore and is led by US-based 3D Glass Solutions.
- It focuses on producing glass substrate panels and advanced 3D heterogeneous integration (3DHI) modules.
- The applications of this technology include artificial intelligence, 5G, defence, and data centers.
- Investors include Intel, Lockheed Martin, and various venture capital and private equity funds.
Significance and Technological Innovation
- This project is part of ten plants approved under the ISM, including a chip fabrication plant by the Tata Group.
- It utilizes glass-based substrates and 3D stacking technologies offering higher precision and thermal stability than traditional silicon-based methods.
- The project's technology aims to address the challenges posed by Moore’s Law by enhancing computing power through vertical stacking.
Economic and Employment Impact
- The facility is anticipated to produce 70,000 glass panels and 50 million assembled units annually.
- It is expected to generate approximately 2,500 direct and indirect jobs.
India Semiconductor Mission (ISM)
- Launched in 2021 with a Rs 76,000-crore outlay to develop a comprehensive chip ecosystem.
- Ten semiconductor projects have been approved across six states, with investments over Rs 1.6 lakh crore.
- The government may introduce ISM 2.0, focusing more on supporting ancillary industries and design-side incentives.
