Foundation stone laid for India’s first Advanced 3D Semiconductor Packaging Unit in Bhubaneswar | Current Affairs | Vision IAS

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In Summary

  • New ATMP facility strengthens India's semiconductor ecosystem, reducing import dependence (currently >90%) and diversifying supply chains.
  • Promotes emerging sectors like AI, 5G, defence, and enhances economic security against global chip shortages.
  • Key initiatives include India Semiconductor Mission, C2S Programme, indigenous processors (SHAKTI, VIKRAM), and global collaborations (iCET).

In Summary

The project marks a significant step towards strengthening the domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat

  • The facility will function as a vertically integrated ATMP (Assembly, Testing, Marking and Packaging) unit

Need and Significance of Promoting Domestic Semiconductor Manufacturing

  • Reduces Import Dependence: Strengthens domestic semiconductor manufacturing capacity, reducing reliance on high import volumes. 
    •  Currently, India imports more than 90% of its semiconductor needs.
  • Supply Chain Diversification: Currently, about 70% of the world's semiconductor manufacturing is concentrated in South Korea, Taiwan, China, the United States, and Japan.
  • Boost to Emerging Sectors: Supports data centres, Artificial Intelligence, machine learning, 5G/6G communications, defence, aerospace and advanced electronics. 
  • Economic Security: Reduces risk from global chip shortages (e.g., Covid-19 and Russia–Ukraine war disruptions).

Initiatives taken to support Semiconductor Industry

  • India Semiconductor Mission (ISM)Semicon India Programme: Aims to build a vibrant semiconductor and display ecosystem to enable India’s emergence as a global hub for electronics manufacturing and design.
  • Talent and Skill Development: Includes Chips to Start-up (C2S) Programme, AICTE Curriculum Updates (introduced specialised engineering programs), etc.
  •  Indigenous Technologies:  Microprocessor Development and Digital India RISC-V Programmes have created native processors such as SHAKTI, VIKRAM, and DHRUV64.
  • Global Collaboration: E.g., India- U.S. Initiative on Critical and Emerging Technology (iCET), U.S.-led Pax Silica Initiative, etc.
  • State Policies: E.g., Gujarat Semiconductor Policy 2022–27
  • Other:  Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS), Electronics Components and Manufacturing Scheme (ECMS), etc. 
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RELATED TERMS

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Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS)

A government scheme providing financial incentives for the manufacturing of electronic components and semiconductors in India, aiming to boost domestic value addition and production.

India- U.S. Initiative on Critical and Emerging Technology (iCET)

A bilateral initiative between India and the United States to foster collaboration in critical and emerging technologies, including semiconductors, artificial intelligence, and advanced telecommunications.

RISC-V

An open-source instruction set architecture (ISA) that allows for greater flexibility and customization in processor design. The Digital India RISC-V Programmes aim to develop indigenous processors based on this architecture.

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